Micron Technology, Inc. Integrated Circuits (ICs) - Memory - Memory MT29F2G01ABBGDM79A3WC1

Description
IC FLASH 2GBIT SPI DIE
Datasheet
Description
IC FLASH 2GBIT SPI DIE
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT29F2G01ABBGDM79A3WC1
Integrated Circuits (ICs) - Memory - Memory MT29F2G01ABBGDM79A3WC1
IC FLASH 2GBIT SPI DIE

IC FLASH 2GBIT SPI DIE

Supplier's Site
FLASH - NAND (SLC) Memory IC 2Gbit SPI Die

FLASH - NAND (SLC) Memory IC 2Gbit SPI Die

Buy Now
SLC 2G DIE 2GX1

SLC 2G DIE 2GX1

Supplier's Site Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT29F2G01ABBGDM79A3WC1 MT29F2G01ABBGDM79A3WC1 MT29F2G01ABBGDM79A3WC1
Product Name Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category Flash; Non-Volatile Flash; FLASH Flash; Flash
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 27LS03DM/B - Lingto Electronic Limited
Rochester Electronics
View Details
3 suppliers
Memory - 8611200826 - Lingto Electronic Limited
Infineon Technologies AG
View Details
2 suppliers
Logic - Logic - FIFOs Memory - 40105BE - 052142-40105BE - Win Source Electronics
Specs
Memory Category FIFO
Operating Temperature -55 to 125 C (-67 to 257 F)
Package Type DIP; 16-PDIP
View Details
Memory - AS4SD2M32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SDRAM; DRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 16000 kbits
View Details