Micron Technology, Inc. Memory M29W640GL70ZF6E

Description
FLASH - NOR Memory IC 64Mb (8M x 8, 4M x 16) Parallel 70ns 64-TBGA (10x13)
Request a Quote
Description
FLASH - NOR Memory IC 64Mb (8M x 8, 4M x 16) Parallel 70ns 64-TBGA (10x13)
Request a Quote
Datasheet
Datasheet Summary
Powered by GS/AI

The M29W640GL70ZF6E is a 64Mbit parallel NOR Flash memory device from Quarktwin Technology Ltd. It operates with a supply voltage range of 2.7V to 3.6V for programming, erasing, and reading, with an optional fast programming voltage of 12V. The device features asynchronous random and page read capabilities, with a page access time of 25ns and random access times of 60ns or 70ns. Memory organization includes 135 blocks: one boot block and seven parameter blocks of 8KB each, along with 127 main blocks of 64KB each. The device supports embedded byte/word programming algorithms and allows for program/erase suspend and resume operations, enabling reading from any block during a suspend operation. The M29W640GL70ZF6E is designed for low power consumption, with a typical program time of 10µs per byte/word and a durability of 100,000 program/erase cycles per block. It is available in RoHS-compliant packages, including a 48-pin TSOP and a 48-ball TFBGA. The device is suitable for applications requiring reliable and efficient memory solutions.

Datasheet Summary
Powered by GS/AI

The M29W640GL70ZF6E is a 64Mbit parallel NOR Flash memory device from Quarktwin Technology Ltd. It operates with a supply voltage range of 2.7V to 3.6V for programming, erasing, and reading, with an optional fast programming voltage of 12V. The device features asynchronous random and page read capabilities, with a page access time of 25ns and random access times of 60ns or 70ns. Memory organization includes 135 blocks: one boot block and seven parameter blocks of 8KB each, along with 127 main blocks of 64KB each. The device supports embedded byte/word programming algorithms and allows for program/erase suspend and resume operations, enabling reading from any block during a suspend operation. The M29W640GL70ZF6E is designed for low power consumption, with a typical program time of 10µs per byte/word and a durability of 100,000 program/erase cycles per block. It is available in RoHS-compliant packages, including a 48-pin TSOP and a 48-ball TFBGA. The device is suitable for applications requiring reliable and efficient memory solutions.

Suppliers

Company
Product
Description
Supplier Links
Memory - M29W640GL70ZF6E-ND - DigiKey
Thief River Falls, MN, United States
FLASH - NOR Memory IC 64Mb (8M x 8, 4M x 16) Parallel 70ns 64-TBGA (10x13)

FLASH - NOR Memory IC 64Mb (8M x 8, 4M x 16) Parallel 70ns 64-TBGA (10x13)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - M29W640GL70ZF6E - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
M29W640GL70ZF6E
Integrated Circuits (ICs) - Memory - Memory M29W640GL70ZF6E
IC FLASH 64MBIT PARALLEL 64TBGA

IC FLASH 64MBIT PARALLEL 64TBGA

Supplier's Site
IC FLASH 64MBIT PARALLEL 64TBGA

IC FLASH 64MBIT PARALLEL 64TBGA

Supplier's Site Datasheet
Memory - M29W640GL70ZF6E - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FLASH - NOR Memory IC 64Mbit Parallel 70 ns 64-TBGA (10x13)

FLASH - NOR Memory IC 64Mbit Parallel 70 ns 64-TBGA (10x13)

Buy Now Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number M29W640GL70ZF6E-ND M29W640GL70ZF6E M29W640GL70ZF6E M29W640GL70ZF6E
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category Flash Flash; Non-Volatile Flash; Flash Flash; FLASH
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Density 64000 kbits 64000 kbits 64000 kbits 64000 kbits
Package Type 64-TBGA BGA; 64-TBGA
Unlock Full Specs
to access all available technical data

Similar Products

Memory - AS8SLC128K32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SRAM; SRAM Chip
Access Time 10 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
 - S25FL064LABBHV030 - Rochester Electronics
Infineon Technologies AG
Specs
Memory Category Flash
Package Type BGA; FBGA
View Details
6 suppliers
SDRAM - 2420767 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category DRAM Chip
Access Time 20 ns
Operating Temperature -40 C (-40 F)
View Details
Memory - S25FL128SAGNFI001J - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category Flash; Flash
Density 128000 kbits
View Details