Micron Technology, Inc. Memory - SDRAM - EDB8132B4PB-8D-F-D EDB8132B4PB-8D-F-D

Description
Manufacturer: Micron Technology Inc. Win Source Part Number: 917823-EDB8132B4PB-8 D-F-D Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400 MHz 168-FBGA (12x12) Package: 168-WFBGA Package: Bulk Mounting: Surface Mount Family Name: EDB8132 Categories: Integrated Circuits (ICs) Case / Package: 168-FBGA (12x12) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Balance Quantity per package: 1680 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0036
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Description
Manufacturer: Micron Technology Inc. Win Source Part Number: 917823-EDB8132B4PB-8 D-F-D Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400 MHz 168-FBGA (12x12) Package: 168-WFBGA Package: Bulk Mounting: Surface Mount Family Name: EDB8132 Categories: Integrated Circuits (ICs) Case / Package: 168-FBGA (12x12) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Balance Quantity per package: 1680 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0036
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - EDB8132B4PB-8D-F-D - 917823-EDB8132B4PB-8D-F-D - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - EDB8132B4PB-8D-F-D
917823-EDB8132B4PB-8D-F-D
Memory - SDRAM - EDB8132B4PB-8D-F-D 917823-EDB8132B4PB-8D-F-D
Manufacturer: Micron Technology Inc. Win Source Part Number: 917823-EDB8132B4PB-8 D-F-D Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400 MHz 168-FBGA (12x12) Package: 168-WFBGA Package: Bulk Mounting: Surface Mount Family Name: EDB8132 Categories: Integrated Circuits (ICs) Case / Package: 168-FBGA (12x12) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Balance Quantity per package: 1680 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 35 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0036

Manufacturer: Micron Technology Inc.
Win Source Part Number: 917823-EDB8132B4PB-8D-F-D
Operating Temperature Range: -30°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400 MHz 168-FBGA (12x12)
Package: 168-WFBGA
Package: Bulk
Mounting: Surface Mount
Family Name: EDB8132
Categories: Integrated Circuits (ICs)
Case / Package: 168-FBGA (12x12)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 60 pct.
Supply and Demand Status: Balance
Quantity per package: 1680
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 35 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036

Buy Now Datasheet
Memory IC and Storage Component - 774-EDB8132B4PB-8D-F-D - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-EDB8132B4PB-8D-F-D
Memory IC and Storage Component 774-EDB8132B4PB-8D-F-D
IC DRAM 8GBIT PARALLEL 168FBGA Product overview: EDB8132B4PB-8D-F-D from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-EDB8132B4PB-8D-F -D can be used for catalog matching and distributor lookup.

IC DRAM 8GBIT PARALLEL 168FBGA Product overview: EDB8132B4PB-8D-F-D from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-EDB8132B4PB-8D-F-D can be used for catalog matching and distributor lookup.

Supplier's Site
IC DRAM 8GBIT PARALLEL 168FBGA

IC DRAM 8GBIT PARALLEL 168FBGA

Supplier's Site Datasheet
Memory - EDB8132B4PB-8D-F-D-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400MHz 168-FBGA (12x12)

SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400MHz 168-FBGA (12x12)

Buy Now Datasheet
IC DRAM 8GBIT PARALLEL 168FBGA

IC DRAM 8GBIT PARALLEL 168FBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - Memory - EDB8132B4PB-8D-F-D - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
EDB8132B4PB-8D-F-D
Integrated Circuits (ICs) - Memory - Memory EDB8132B4PB-8D-F-D
IC DRAM 8GBIT PARALLEL 168FBGA

IC DRAM 8GBIT PARALLEL 168FBGA

Supplier's Site
Memory - EDB8132B4PB-8D-F-D - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2 Memory IC 8Gbit Parallel 400 MHz 168-FBGA (12x12)

SDRAM - Mobile LPDDR2 Memory IC 8Gbit Parallel 400 MHz 168-FBGA (12x12)

Buy Now Datasheet
Dram, 256M X 32Bit, -30 To 85Deg C; Dram Type Micron - 80AH6056 - Newark, An Avnet Company
Chicago, IL, United States
Dram, 256M X 32Bit, -30 To 85Deg C; Dram Type Micron
80AH6056
Dram, 256M X 32Bit, -30 To 85Deg C; Dram Type Micron 80AH6056
DRAM, 256M X 32BIT, -30 TO 85DEG C; DRAM Type:LPDDR2; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:400MHz; Memory Case Style:WFBGA; No. of Pins:168Pins; Supply Voltage Nom:1.2V; Access Time:2.5ns RoHS Compliant: Yes

DRAM, 256M X 32BIT, -30 TO 85DEG C; DRAM Type:LPDDR2; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:400MHz; Memory Case Style:WFBGA; No. of Pins:168Pins; Supply Voltage Nom:1.2V; Access Time:2.5ns RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. ODG (Origin Data Global) DigiKey Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Newark, An Avnet Company
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 917823-EDB8132B4PB-8D-F-D 774-EDB8132B4PB-8D-F-D EDB8132B4PB-8D-F-D EDB8132B4PB-8D-F-D-ND EDB8132B4PB-8D-F-D EDB8132B4PB-8D-F-D EDB8132B4PB-8D-F-D 80AH6056
Product Name Memory - SDRAM - EDB8132B4PB-8D-F-D Memory IC and Storage Component Memory Memory Memory Integrated Circuits (ICs) - Memory - Memory Memory Dram, 256M X 32Bit, -30 To 85Deg C; Dram Type Micron
Memory Category DRAM Chip Volatile; DRAM Chip SDRAM - Mobile LPDDR2; DRAM Chip DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F)
Package Type BGA; 168-FBGA (12x12) BGA; Bulk 168-WFBGA 168-WFBGA BGA; 168-WFBGA WFBGA
Density 8000000 kbits 8000000 kbits 8000000 kbits 8000000 kbits 8000000 kbits 8000000 kbits
Number of Words 32000 k
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