Micron Technology, Inc. Integrated Circuits (ICs) - Memory - Memory ECF620AAACN-C2-Y3-ES

Description
LPDDR3 6G DIE 192MX32
Datasheet
Description
LPDDR3 6G DIE 192MX32
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Futian, China
Integrated Circuits (ICs) - Memory - Memory
ECF620AAACN-C2-Y3-ES
Integrated Circuits (ICs) - Memory - Memory ECF620AAACN-C2-Y3-ES
LPDDR3 6G DIE 192MX32

LPDDR3 6G DIE 192MX32

Supplier's Site
Memory - ECF620AAACN-C2-Y3-ES - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

Buy Now
LPDDR3 6G DIE 192MX32

LPDDR3 6G DIE 192MX32

Supplier's Site Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number ECF620AAACN-C2-Y3-ES ECF620AAACN-C2-Y3-ES ECF620AAACN-C2-Y3-ES
Product Name Integrated Circuits (ICs) - Memory - Memory Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 28486511 B - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
Memory - MYX4DD3K512M64PBG2 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 4096000 kbits
View Details
Flash Memory - 1882648P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 1024000 kbits
Package Type SOIC; SOIC
View Details
Memory - 71256L25YI - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 25 ns
Density 256 kbits
View Details