Micron Technology, Inc. Memory ECF620AAACN-C1-Y3-ES

Description
LPDDR3 6G DIE 192MX32
Datasheet
Description
LPDDR3 6G DIE 192MX32
Datasheet

Suppliers

Company
Product
Description
Supplier Links
LPDDR3 6G DIE 192MX32

LPDDR3 6G DIE 192MX32

Supplier's Site Datasheet
Futian, China
Integrated Circuits (ICs) - Memory - Memory
ECF620AAACN-C1-Y3-ES
Integrated Circuits (ICs) - Memory - Memory ECF620AAACN-C1-Y3-ES
LPDDR3 6G DIE 192MX32

LPDDR3 6G DIE 192MX32

Supplier's Site
Memory - ECF620AAACN-C1-Y3-ES - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

Buy Now

Technical Specifications

  Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number ECF620AAACN-C1-Y3-ES ECF620AAACN-C1-Y3-ES ECF620AAACN-C1-Y3-ES
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

SDRAM - 1882676 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category DRAM Chip
Access Time 5 ns
Bits per Word 8 bits
View Details
FIFOs Memory - MPD23754MPZP - Quarktwin Technology Ltd.
View Details
2 suppliers
Memory - AS5SP256K36 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SSRAM; SRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 2048 kbits
View Details
Memory - 71256S85TDB - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 85 ns
Density 256 kbits
View Details