ECF00453ZCN-Y3 -- INTEGRATED CIRCUITS (ICS) - MEMORY - MEMORY
Micron Technology, Inc.
Integrated Circuits (ICs) - Memory - Memory
ECF00453ZCN-Y3
Description
LPDDR3 6G DIE 192MX32
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Quarktwin Technology Ltd.
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Lingto Electronic Limited
Datasheet
Description
LPDDR3 6G DIE 192MX32
Datasheet
Suppliers
Supplier's Site
Datasheet
Technical Specifications
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Product Category
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Memory Chips |
Memory Chips |
Memory Chips |
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Product Number
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ECF00453ZCN-Y3 |
ECF00453ZCN-Y3 |
ECF00453ZCN-Y3 |
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Product Name
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Integrated Circuits (ICs) - Memory - Memory |
Memory |
Memory |
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Memory Category
Flash
Density
64000 kbits
Package Type
USON
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Memory Category
SRAM; SRAM Chip
Access Time
15 ns
Operating Temperature
-55 to 125 C (-67 to 257 F)
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Memory Category
FIFO
Package Type
DIP; DIP24
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