LPDDR2 1G DIE 32MX32 Product overview: ECB130ABDCN-Y3 from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-ECB130ABDCN-Y3 can be used for catalog matching and distributor lookup.
Win Source Part Number: 943284-ECB130ABDCN-Y
Series: *
Categories: Memory
LPDDR2 1G DIE 32MX32
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-ECB130ABDCN-Y3 | 943284-ECB130ABDCN-Y3 | ECB130ABDCN-Y3 | ECB130ABDCN-Y3 | ECB130ABDCN-Y3 |
| Product Name | Memory IC and Storage Component | Memory - DDR - ECB130ABDCN-Y3 | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Package Type | Bulk |
