Micron Technology, Inc. Memory - DDR - ECB130ABDCN-Y3 ECB130ABDCN-Y3

Description
Win Source Part Number: 943284-ECB130ABDCN-Y 3 Series: * Categories: Memory
Request a Quote Datasheet
Description
Win Source Part Number: 943284-ECB130ABDCN-Y 3 Series: * Categories: Memory
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - DDR - ECB130ABDCN-Y3 - 943284-ECB130ABDCN-Y3 - Win Source Electronics
Laguna Hills, CA, United States
Memory - DDR - ECB130ABDCN-Y3
943284-ECB130ABDCN-Y3
Memory - DDR - ECB130ABDCN-Y3 943284-ECB130ABDCN-Y3
Win Source Part Number: 943284-ECB130ABDCN-Y 3 Series: * Categories: Memory

Win Source Part Number: 943284-ECB130ABDCN-Y3
Series: *
Categories: Memory

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Memory IC and Storage Component - 774-ECB130ABDCN-Y3 - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-ECB130ABDCN-Y3
Memory IC and Storage Component 774-ECB130ABDCN-Y3
LPDDR2 1G DIE 32MX32 Product overview: ECB130ABDCN-Y3 from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-ECB130ABDCN-Y3 can be used for catalog matching and distributor lookup.

LPDDR2 1G DIE 32MX32 Product overview: ECB130ABDCN-Y3 from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-ECB130ABDCN-Y3 can be used for catalog matching and distributor lookup.

Supplier's Site
LPDDR2 1G DIE 32MX32

LPDDR2 1G DIE 32MX32

Supplier's Site Datasheet
Futian, China
Integrated Circuits (ICs) - Memory - Memory
ECB130ABDCN-Y3
Integrated Circuits (ICs) - Memory - Memory ECB130ABDCN-Y3
LPDDR2 1G DIE 32MX32

LPDDR2 1G DIE 32MX32

Supplier's Site
Memory - ECB130ABDCN-Y3 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

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Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 943284-ECB130ABDCN-Y3 774-ECB130ABDCN-Y3 ECB130ABDCN-Y3 ECB130ABDCN-Y3 ECB130ABDCN-Y3
Product Name Memory - DDR - ECB130ABDCN-Y3 Memory IC and Storage Component Memory Integrated Circuits (ICs) - Memory - Memory Memory
Package Type Bulk
Unlock Full Specs
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