Microchip Technology, Inc. 1 Port FE Cu PHY with RGMII/RMII (Ind. Temp) VSC8530

Description
Low-power, small form-factor Cu PHY with IEEE 802.3az Energy Efficient Ethernet (EEE) and Wake-on-LAN (WoL), with widest I/O LVCMOS support. The VSC8530-04 device, offered in a tiny 6 mm x 6 mm single row QFN package, is designed for space-constrained 10BASE-T/10BASE-Te/1 00BASE-TX applications. It features integrated line-side termination to conserve board space, lower EMI, and improve system performance. Additionally, integrated RGMII version 2.0 standard timing compliant compensation eliminates the need for on-board delay lines. The device supports the industry’s widest range of LVCMOS levels for a parallel MAC interface including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, as well as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V support on the MDIO/MDC interface. VSC8530-04 includes Microchip’s EcoEthernet™ 2.0 technology with Energy Efficient Ethernet and power saving features to reduce power based on link state and cable reach. It optimizes power consumption at all link operating speeds, and features Wake-on-LAN power management using magic packets. Additional Features EcoEthernet™ 2.0, with Energy Efficient Ethernet (EEE) Widest voltage range, fully-compliant parallel MAC interface device Tiny 6 mm x 6 mm QFN package Configurable drive strength on MAC interface enables better control of system-level EMI/EMC
Datasheet
Description
Low-power, small form-factor Cu PHY with IEEE 802.3az Energy Efficient Ethernet (EEE) and Wake-on-LAN (WoL), with widest I/O LVCMOS support. The VSC8530-04 device, offered in a tiny 6 mm x 6 mm single row QFN package, is designed for space-constrained 10BASE-T/10BASE-Te/1 00BASE-TX applications. It features integrated line-side termination to conserve board space, lower EMI, and improve system performance. Additionally, integrated RGMII version 2.0 standard timing compliant compensation eliminates the need for on-board delay lines. The device supports the industry’s widest range of LVCMOS levels for a parallel MAC interface including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, as well as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V support on the MDIO/MDC interface. VSC8530-04 includes Microchip’s EcoEthernet™ 2.0 technology with Energy Efficient Ethernet and power saving features to reduce power based on link state and cable reach. It optimizes power consumption at all link operating speeds, and features Wake-on-LAN power management using magic packets. Additional Features EcoEthernet™ 2.0, with Energy Efficient Ethernet (EEE) Widest voltage range, fully-compliant parallel MAC interface device Tiny 6 mm x 6 mm QFN package Configurable drive strength on MAC interface enables better control of system-level EMI/EMC
Datasheet

Suppliers

Company
Product
Description
Supplier Links
1 Port FE Cu PHY with RGMII/RMII (Ind. Temp) - VSC8530 - Microchip Technology, Inc.
Chandler, AZ, United States
1 Port FE Cu PHY with RGMII/RMII (Ind. Temp)
VSC8530
1 Port FE Cu PHY with RGMII/RMII (Ind. Temp) VSC8530
Low-power, small form-factor Cu PHY with IEEE 802.3az Energy Efficient Ethernet (EEE) and Wake-on-LAN (WoL), with widest I/O LVCMOS support. The VSC8530-04 device, offered in a tiny 6 mm x 6 mm single row QFN package, is designed for space-constrained 10BASE-T/10BASE-Te/1 00BASE-TX applications. It features integrated line-side termination to conserve board space, lower EMI, and improve system performance. Additionally, integrated RGMII version 2.0 standard timing compliant compensation eliminates the need for on-board delay lines. The device supports the industry’s widest range of LVCMOS levels for a parallel MAC interface including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, as well as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V support on the MDIO/MDC interface. VSC8530-04 includes Microchip’s EcoEthernet™ 2.0 technology with Energy Efficient Ethernet and power saving features to reduce power based on link state and cable reach. It optimizes power consumption at all link operating speeds, and features Wake-on-LAN power management using magic packets. Additional Features EcoEthernet™ 2.0, with Energy Efficient Ethernet (EEE) Widest voltage range, fully-compliant parallel MAC interface device Tiny 6 mm x 6 mm QFN package Configurable drive strength on MAC interface enables better control of system-level EMI/EMC

Low-power, small form-factor Cu PHY with IEEE 802.3az Energy Efficient Ethernet (EEE) and Wake-on-LAN (WoL), with widest I/O LVCMOS support.
The VSC8530-04 device, offered in a tiny 6 mm x 6 mm single row QFN package, is designed for space-constrained 10BASE-T/10BASE-Te/100BASE-TX applications. It features integrated line-side termination to conserve board space, lower EMI, and improve system performance. Additionally, integrated RGMII version 2.0 standard timing compliant compensation eliminates the need for on-board delay lines.
The device supports the industry’s widest range of LVCMOS levels for a parallel MAC interface including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, as well as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V support on the MDIO/MDC interface.
VSC8530-04 includes Microchip’s EcoEthernet™ 2.0 technology with Energy Efficient Ethernet and power saving features to reduce power based on link state and cable reach. It optimizes power consumption at all link operating speeds, and features Wake-on-LAN power management using magic packets.

Additional Features

    • EcoEthernet™ 2.0, with Energy Efficient Ethernet (EEE)
    • Widest voltage range, fully-compliant parallel MAC interface device
    • Tiny 6 mm x 6 mm QFN package
    • Configurable drive strength on MAC interface enables better control of system-level EMI/EMC
Supplier's Site Datasheet

Technical Specifications

  Microchip Technology, Inc.
Product Category Network and Communication Chips
Product Number VSC8530
Product Name 1 Port FE Cu PHY with RGMII/RMII (Ind. Temp)
Data Rate 10000 to 100000 kbps
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