Microchip Technology, Inc. Silicon Carbide Test/Evaluation Products MSCSICSP3/REF2

Description
SiC SP3 Module Driver Reference Design The MSCSICSP3/REF2 reference design provides an example of a highly isolated SiC MOSFET dual-gate driver for the SiC SP3 phase leg modules. It can be configured by switches to drive in a half bridge configuration with only side on at any time and with dead time protection. It can also be configured to provide concurrent drive, if necessary. This design is intended for use with Microsemi SiC SP3 modules. Key features of this half-bridge module driver solution compatible with SP3F standard modules: 400 kHz maximum switching frequency 16 W of gate drive power per side 30 A peak output current -5 V/+20 V gate drive voltage +/-100 kV/us capability Galvanic isolation of more than 2000 V on both gate drivers
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Description
SiC SP3 Module Driver Reference Design The MSCSICSP3/REF2 reference design provides an example of a highly isolated SiC MOSFET dual-gate driver for the SiC SP3 phase leg modules. It can be configured by switches to drive in a half bridge configuration with only side on at any time and with dead time protection. It can also be configured to provide concurrent drive, if necessary. This design is intended for use with Microsemi SiC SP3 modules. Key features of this half-bridge module driver solution compatible with SP3F standard modules: 400 kHz maximum switching frequency 16 W of gate drive power per side 30 A peak output current -5 V/+20 V gate drive voltage +/-100 kV/us capability Galvanic isolation of more than 2000 V on both gate drivers
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Suppliers

Company
Product
Description
Supplier Links
Silicon Carbide Test/Evaluation Products - MSCSICSP3/REF2 - Richardson RFPD
Downers Grove, IL, United States
Silicon Carbide Test/Evaluation Products
MSCSICSP3/REF2
Silicon Carbide Test/Evaluation Products MSCSICSP3/REF2
SiC SP3 Module Driver Reference Design The MSCSICSP3/REF2 reference design provides an example of a highly isolated SiC MOSFET dual-gate driver for the SiC SP3 phase leg modules. It can be configured by switches to drive in a half bridge configuration with only side on at any time and with dead time protection. It can also be configured to provide concurrent drive, if necessary. This design is intended for use with Microsemi SiC SP3 modules. Key features of this half-bridge module driver solution compatible with SP3F standard modules: 400 kHz maximum switching frequency 16 W of gate drive power per side 30 A peak output current -5 V/+20 V gate drive voltage +/-100 kV/us capability Galvanic isolation of more than 2000 V on both gate drivers

SiC SP3 Module Driver Reference Design

The MSCSICSP3/REF2 reference design provides an example of a highly isolated SiC MOSFET dual-gate driver for the SiC SP3 phase leg modules. It can be configured by switches to drive in a half bridge configuration with only side on at any time and with dead time protection. It can also be configured to provide concurrent drive, if necessary. This design is intended for use with Microsemi SiC SP3 modules.

Key features of this half-bridge module driver solution compatible with SP3F standard modules:

  • 400 kHz maximum switching frequency
  • 16 W of gate drive power per side
  • 30 A peak output current
  • -5 V/+20 V gate drive voltage
  • +/-100 kV/us capability
  • Galvanic isolation of more than 2000 V on both gate drivers
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Technical Specifications

  Richardson RFPD
Product Category Electronic Development Boards
Product Number MSCSICSP3/REF2
Product Name Silicon Carbide Test/Evaluation Products
Category Developement Board
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