Microchip Technology, Inc. RF PIN Diode MPL4700-206

Description
This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.
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Description
This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.
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Suppliers

Company
Product
Description
Supplier Links
RF PIN Diode - MPL4700-206 - Richardson RFPD
Downers Grove, IL, United States
RF PIN Diode
MPL4700-206
RF PIN Diode MPL4700-206
This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.

This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.

Supplier's Site
Discrete Semiconductor Products - Diodes - RF Diodes - MPL4700-206 - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Discrete Semiconductor Products - Diodes - RF Diodes
MPL4700-206
Discrete Semiconductor Products - Diodes - RF Diodes MPL4700-206
SI LIMITER NON HERMETIC MMSM

SI LIMITER NON HERMETIC MMSM

Supplier's Site

Technical Specifications

  Richardson RFPD Shenzhen Shengyu Electronics Technology Limited
Product Category RF Diodes RF Diodes
Product Number MPL4700-206 MPL4700-206
Product Name RF PIN Diode Discrete Semiconductor Products - Diodes - RF Diodes
Configuration Single
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