Microchip Technology, Inc. RF PIN Diode MPL4700-206/TR

Description
This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.
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Description
This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.
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Suppliers

Company
Product
Description
Supplier Links
RF PIN Diode - MPL4700-206/TR - Richardson RFPD
Downers Grove, IL, United States
RF PIN Diode
MPL4700-206/TR
RF PIN Diode MPL4700-206/TR
This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.

This series of surface mount PIN and Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. This series of devices meets RoHS requirements per EU Directive 2002/95/EC.

Supplier's Site
Discrete Semiconductor Products - Diodes - RF Diodes - MPL4700-206/TR - Acme Chip Technology Co., Limited
Shenzhen, China
Discrete Semiconductor Products - Diodes - RF Diodes
MPL4700-206/TR
Discrete Semiconductor Products - Diodes - RF Diodes MPL4700-206/TR
SI LIMITER NON HERMETIC MMSM

SI LIMITER NON HERMETIC MMSM

Supplier's Site

Technical Specifications

  Richardson RFPD Acme Chip Technology Co., Limited
Product Category RF Diodes RF Diodes
Product Number MPL4700-206/TR MPL4700-206/TR
Product Name RF PIN Diode Discrete Semiconductor Products - Diodes - RF Diodes
Configuration Single
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