Microchip Technology, Inc. CAN FD Transmitter with Wake-Up Pattern Option MCP2542FD

The MCP2542FD CAN transceiver is designed for high-speed CAN FD applications up to 8Mbps communication speed. The maximum propagation delay was improved to support longer bus length.The device meets the automotive requirements for CAN FD bit rates exceeding 2 Mbps, low quiescent current, electromagnetic compatibility (EMC) and electrostatic discharge (ESD). For 12V- applications please consider the ATA6561 Please see our MikroElektronika click board! http://www.mikroe.co m/click/mcp2542 Additional Features Supports CAN 2.0 and CAN with Flexible Data Rate CAN FD) Physical Layer Transceiver Requirements Optimized for CAN FD at 2, 5 and 8 Mbps Operation Maximum propagation delay: 120 ns Loop delay symmetry: ±10% (2 Mbps) Wake-up on CAN activity, 3.6 μs filter time Implements ISO11898-2:2003, ISO11898-5:2007, and ISO/DIS11898-2:2015 Qualification: AEC-Q100 Rev. G, Grade 0 (-40°C to +150°C) Very Low Standby Current (4 μA, typical) VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5V I/O CAN Bus Pins are Disconnected when Device is Unpowered An unpowered node or brown-out event will not load the CAN bus Device is unpowered if VDD or VIO drop below its POR level Detection of Ground Fault: Permanent Dominant detection on TXD Permanent Dominant detection on bus Automatic Thermal Shutdown Protection Suitable for 12V and 24V Systems Meets or Exceeds Stringent Automotive Design Requirements Including “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”, Version 1.3, May 2012 Conducted emissions @ 2 Mbps with Common-Mode Choke (CMC) Direct Power Injection (DPI) @ 2Mbps with CMC Meets SAE J2962/2 “Communication Transceiver Qualification Requirements CAN” Radiated emissions @ 2Mbps without a CMC High Electrostatic Discharge (ESD) Protection on CANH and CANL, meeting IEC61000-4-2 up to ±13kV Temperature ranges: Extended (E): -40°C to +125°C High (H): -40°C to +150°C Smallest package option in the industry 2x3 DFN-8L Also available in SOIC-8L and 3x3 DFN-8L