Win Source Part Number: 1353217-M2S090-FGG67
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Temperature Range - Operating: 0°C ~ 85°C (TJ)
Fake Threat In the Open Market: 39 pct.
MSL Level: 3 (168 Hours)
Mfr: Microchip Technology
Series: SmartFusion®2
Package: Tray
Product Status: Active
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
Base Product Number: M2S090
HTSUS: 8542.39.0001
REACH Status: REACH Unaffected
ECCN: 3A991D
Speed: 166MHz
Number of I/O: 425
Core Processor: ARM® Cortex®-M3
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Architecture: MCU, FPGA
Flash Size: 512KB
Primary Attributes: FPGA - 90K Logic Modules
IC SOC CORTEX-M3 166MHZ 676FBGA
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)
IC SOC CORTEX-M3 166MHZ 676FBGA
IC SOC CORTEX-M3 166MHZ 676FBGA
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)
| Win Source Electronics | ODG (Origin Data Global) | DigiKey | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1353217-M2S090-FGG676 | M2S090-FGG676 | M2S090-FGG676-ND | M2S090-FGG676 | M2S090-FGG676 | M2S090-FGG676 |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | ARM® Cortex®-M3 | ARM | ARM; ARM® Cortex®-M3 | ARM | ARM; ARM® Cortex®-M3 |
| Package / Case | Tray | 676-BGA | 676-BGA | |||
| RAM Size | 0.0640 MB | 0.0640 MB | 0.0640 MB | 0.0640 MB | 0.0640 MB | |
| Number of Inputs/Outputs | 425 # | 425 # |
