Microchip Technology, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) M2S060-FCSG325I

Description
Win Source Part Number: 1261808-M2S060-FCSG3 25I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion®2 Core Processor: ARM® Cortex®-M3 Speed: 166MHz Package: Tray Standard Package: 176 Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Number of I/O: 200 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: FPGA - 60K Logic Modules Package / Case: 325-TFBGA, FCBGA Supplier Device Package: 325-FCBGA (11x11) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 81 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Other Names: 1100-1362,M2S060-FCS G325I Base Product Number: M2S060
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Description
Win Source Part Number: 1261808-M2S060-FCSG3 25I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion®2 Core Processor: ARM® Cortex®-M3 Speed: 166MHz Package: Tray Standard Package: 176 Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Number of I/O: 200 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: FPGA - 60K Logic Modules Package / Case: 325-TFBGA, FCBGA Supplier Device Package: 325-FCBGA (11x11) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 81 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Other Names: 1100-1362,M2S060-FCS G325I Base Product Number: M2S060
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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1261808-M2S060-FCSG325I - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1261808-M2S060-FCSG325I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1261808-M2S060-FCSG325I
Win Source Part Number: 1261808-M2S060-FCSG3 25I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion®2 Core Processor: ARM® Cortex®-M3 Speed: 166MHz Package: Tray Standard Package: 176 Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Number of I/O: 200 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: FPGA - 60K Logic Modules Package / Case: 325-TFBGA, FCBGA Supplier Device Package: 325-FCBGA (11x11) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 81 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Other Names: 1100-1362,M2S060-FCS G325I Base Product Number: M2S060

Win Source Part Number: 1261808-M2S060-FCSG325I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: SmartFusion®2
Core Processor: ARM® Cortex®-M3
Speed: 166MHz
Package: Tray
Standard Package: 176
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Number of I/O: 200
RAM Size: 64KB
Flash Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: FPGA - 60K Logic Modules
Package / Case: 325-TFBGA, FCBGA
Supplier Device Package: 325-FCBGA (11x11)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 81 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: Microchip Technology
Other Names: 1100-1362,M2S060-FCSG325I
Base Product Number: M2S060

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Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1261808-M2S060-FCSG325I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature -40 to 100 C (-40 to 212 F)
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