Manufacturer: Microchip Technology
Category: Integrated Circuits (ICs) -Embedded- System On Chip (SoC)
Series: SmartFusion®2
Package: Tray
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 5K Logic Modules 166MHz 256-FPBGA (17x17)
IC SOC CORTEX-M3 166MHZ 256FBGA
IC SOC CORTEX-M3 166MHZ 256FBGA
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 5K Logic Modules 166MHz 256-FPBGA (17x17)
IC SOC CORTEX-M3 166MHZ 256FBGA
| Win Source Electronics | DigiKey | Lingto Electronic Limited | ODG (Origin Data Global) | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1100-1346-ND | M2S005S-VFG256I | M2S005S-VFG256I | M2S005S-VFG256I | M2S005S-VFG256I | |
| Product Name | Integrated Circuits (ICs) -Embedded- System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
| Package / Case | Tray | 256-LBGA | 256-LBGA | |||
| RAM Size | 0.0640 MB | 0.0640 MB | 0.0640 MB | 0.0640 MB | 0.0640 MB | |
| Operating Temperature | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | ||
| Processor Core | ARM | ARM; ARM® Cortex®-M3 | ARM® Cortex®-M3 | ARM; ARM® Cortex®-M3 | ARM |
