The innovative Le57D111 dual-channel SLIC device is designed for high-density POTS applications requiring a small footprint SLIC device with significant power savings. By combining the line interface of two channels into one SLIC device, the Le57D111 device enables the design of a low cost, high performance, and fully programmable line interface for multiple country applications worldwide. The on-chip Thermal Management (TMG) feature allows for significantly reduced power dissipation on the device. The Le57D111 device is offered in space-saving package types, 44-pin eTQFP and 32-pin PLCC. The small footprint of the SLIC device allows designers to save board space, increasing the density of lines on the board. The Le57D111 device is also designed to significantly reduce the number of external components required for linecard design. Microchip offers a range of compatible codec/filters that perform the codec function in a line card. In particular the QLSLAC device, another member of the VE580 series, combined with the Le57D111 device provides a programmable line circuit that can be configured for varying requirements. The system is very flexible and supports several low power wakeup options. Extremely low power is achievable using the 2.45 GHz ISM Band Wakeup-receiver option. The high level of integration includes a Media Access Controller, providing complete control of the device along with coding and decoding of RF messages. A standard SPI interface provides for easy access by the application.
Additional Features
Dual-channel SLIC device with small footprint
On-chip Thermal Management (TMG) feature in Normal and Reverse Polarity
Control states: Active (Normal and Reverse Polarity),
Standby, and Disconnect
On-hook transmission
Low standby power
-39 to -58 V battery operation
Two-wire impedance set by single external impedance
Device level thermal shutdown
Set on-chip constant-current feed
Programmable ring-trip detect threshold
Only +5 V and battery supply required
The innovative Le57D111 dual-channel SLIC device is designed for high-density POTS applications requiring a small footprint SLIC device with significant power savings. By combining the line interface of two channels into one SLIC device, the Le57D111 device enables the design of a low cost, high performance, and fully programmable line interface for multiple country applications worldwide. The on-chip Thermal Management (TMG) feature allows for significantly reduced power dissipation on the device. The Le57D111 device is offered in space-saving package types, 44-pin eTQFP and 32-pin PLCC. The small footprint of the SLIC device allows designers to save board space, increasing the density of lines on the board. The Le57D111 device is also designed to significantly reduce the number of external components required for linecard design. Microchip offers a range of compatible codec/filters that perform the codec function in a line card. In particular the QLSLAC device, another member of the VE580 series, combined with the Le57D111 device provides a programmable line circuit that can be configured for varying requirements. The system is very flexible and supports several low power wakeup options. Extremely low power is achievable using the 2.45 GHz ISM Band Wakeup-receiver option. The high level of integration includes a Media Access Controller, providing complete control of the device along with coding and decoding of RF messages. A standard SPI interface provides for easy access by the application.
Additional Features
- Dual-channel SLIC device with small footprint
- On-chip Thermal Management (TMG) feature in Normal and Reverse Polarity
- Control states: Active (Normal and Reverse Polarity),
- Standby, and Disconnect
- On-hook transmission
- Low standby power
- -39 to -58 V battery operation
- Two-wire impedance set by single external impedance
- Device level thermal shutdown
- Set on-chip constant-current feed
- Programmable ring-trip detect threshold
- Only +5 V and battery supply required
