Microchip Technology, Inc. LIN System in Package SiP (ATA6624C + ATtiny167 µC) ATA6617C

Description
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chi p (LIN-SBC), ATA6624 has an integrated LIN transceiver, 5V regulator and window watchdog. The second chip contains the Microchip AVR ATtiny167 8-bit automotive microcontroller with advanced RISC architecture with 16 Kbytes of flash memory. All pins of the LIN-SBC and AVR microcontroller are bonded out to provide customers the same flexibility for their applications as they do with discrete devices. Additional Features Single-package High Performance, Low Power AVR 8-bit Microcontroller with LIN Transceiver, 5V Regulator (85mA Current Capability) and Watchdog Very Low Current Consumption in Sleep Mode
Datasheet
Description
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chi p (LIN-SBC), ATA6624 has an integrated LIN transceiver, 5V regulator and window watchdog. The second chip contains the Microchip AVR ATtiny167 8-bit automotive microcontroller with advanced RISC architecture with 16 Kbytes of flash memory. All pins of the LIN-SBC and AVR microcontroller are bonded out to provide customers the same flexibility for their applications as they do with discrete devices. Additional Features Single-package High Performance, Low Power AVR 8-bit Microcontroller with LIN Transceiver, 5V Regulator (85mA Current Capability) and Watchdog Very Low Current Consumption in Sleep Mode
Datasheet

Suppliers

Company
Product
Description
Supplier Links
LIN System in Package SiP (ATA6624C + ATtiny167 µC) - ATA6617C - Microchip Technology, Inc.
Chandler, AZ, United States
LIN System in Package SiP (ATA6624C + ATtiny167 µC)
ATA6617C
LIN System in Package SiP (ATA6624C + ATtiny167 µC) ATA6617C
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chi p (LIN-SBC), ATA6624 has an integrated LIN transceiver, 5V regulator and window watchdog. The second chip contains the Microchip AVR ATtiny167 8-bit automotive microcontroller with advanced RISC architecture with 16 Kbytes of flash memory. All pins of the LIN-SBC and AVR microcontroller are bonded out to provide customers the same flexibility for their applications as they do with discrete devices. Additional Features Single-package High Performance, Low Power AVR 8-bit Microcontroller with LIN Transceiver, 5V Regulator (85mA Current Capability) and Watchdog Very Low Current Consumption in Sleep Mode

The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chip (LIN-SBC), ATA6624 has an integrated LIN transceiver, 5V regulator and window watchdog. The second chip contains the Microchip AVR ATtiny167 8-bit automotive microcontroller with advanced RISC architecture with 16 Kbytes of flash memory. All pins of the LIN-SBC and AVR microcontroller are bonded out to provide customers the same flexibility for their applications as they do with discrete devices.

Additional Features

    • Single-package High Performance, Low Power AVR 8-bit Microcontroller with LIN Transceiver, 5V Regulator (85mA Current Capability) and Watchdog
    • Very Low Current Consumption in Sleep Mode
Supplier's Site Datasheet

Technical Specifications

  Microchip Technology, Inc.
Product Category System on a Chip (SoC)
Product Number ATA6617C
Product Name LIN System in Package SiP (ATA6624C + ATtiny167 µC)
Unlock Full Specs
to access all available technical data

Similar Products