The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first chip, ATA6630 (LIN-system-basis-ch
ip), has an integrated LIN transceiver, 5V voltage regulator and a window watchdog. The second chip contains the Microchip AVR ATmega328P automotive microcontroller with advanced RISC architecture and 32 Kbytes flash memory. All pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts.
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first chip, ATA6630 (LIN-system-basis-chip), has an integrated LIN transceiver, 5V voltage regulator and a window watchdog. The second chip contains the Microchip AVR ATmega328P automotive microcontroller with advanced RISC architecture and 32 Kbytes flash memory. All pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts.
