Application
Solar converter
Uninterruptible Power Supplies
Features
Q1, Q2 SiC Power MOSFET
Low RDS(on)
High temperature performance
Q3, Q4 Trench + field Stop IGBT3
Low voltage drop
Low tail current
Switching frequency up to 20 kHz
SiC Schottky Diode (CR1 to CR4)
Zero reverse recovery
Zero forward recovery
Temperature Independent switching behavior
Positive temperature coefficient on VF
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
AlN substrate for improved thermal performance
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Richardson RFPD
Done
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Description
Application
Solar converter
Uninterruptible Power Supplies
Features
Q1, Q2 SiC Power MOSFET
Low RDS(on)
High temperature performance
Q3, Q4 Trench + field Stop IGBT3
Low voltage drop
Low tail current
Switching frequency up to 20 kHz
SiC Schottky Diode (CR1 to CR4)
Zero reverse recovery
Zero forward recovery
Temperature Independent switching behavior
Positive temperature coefficient on VF
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
AlN substrate for improved thermal performance
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Application
Solar converter
Uninterruptible Power Supplies
Features
Q1, Q2 SiC Power MOSFET
Low RDS(on)
High temperature performance
Q3, Q4 Trench + field Stop IGBT3
Low voltage drop
Low tail current
Switching frequency up to 20 kHz
SiC Schottky Diode (CR1 to CR4)
Zero reverse recovery
Zero forward recovery
Temperature Independent switching behavior
Positive temperature coefficient on VF
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
AlN substrate for improved thermal performance
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant