Manufacturer: Microchip Technology
Win Source Part Number: 858877-A2F200M3F-FGG
Series: SmartFusion®
Operating Temperature Range: 0°C ~ 85°C (TJ)
Features: ARM® Cortex®-M3 System On Chip (SOC) IC series ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)
Core Processor: ARM® Cortex®-M3
Speed: 80MHz
Package: Tray
Package: 256-LBGA
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 25, FPGA - 66
Family Name: A2F200
Categories: Integrated Circuits (ICs)
Case / Package: 256-FPBGA (17x17)
ECCN: 3A991D
Popularity: Medium
Fake Threat In the Open Market: 48 pct.
Supply and Demand Status: Limited
Quantity per package: 1
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 37 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Other Part Number: 1100-1003, A2F200M3FFGG256
IC SOC CORTEX-M3 80MHZ 256FBGA
IC SOC CORTEX-M3 80MHZ 256FBGA
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)
| Win Source Electronics | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 858877-A2F200M3F-FGG256 | A2F200M3F-FGG256 | A2F200M3F-FGG256 | A2F200M3F-FGG256 |
| Product Name | Embedded - Embedded - System On Chip (SoC) - A2F200M3F-FGG256 | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | ARM | ARM; ARM® Cortex®-M3 | ARM; ARM® Cortex®-M3 |
| Package / Case | 256-LBGA | 256-LBGA | ||
| Operating Temperature | 32 to 185 F (0.0 to 85 C) | 32 to 185 F (0.0 to 85 C) | 32 to 185 F (0.0 to 85 C) |
