Microchip Technology, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) A2F200M3F-1FGG484

Description
Win Source Part Number: 1381285-A2F200M3F-1F GG484 Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 100MHz Package: Tray Standard Package: 1 pcs Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 41, FPGA - 94 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Temperature Range - Operating: 0°C ~ 85°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 47 pct. REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Base Product Number: A2F200 Moisture Sensitivity Level (MSL): 3 (168 Hours)
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Description
Win Source Part Number: 1381285-A2F200M3F-1F GG484 Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 100MHz Package: Tray Standard Package: 1 pcs Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 41, FPGA - 94 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Temperature Range - Operating: 0°C ~ 85°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 47 pct. REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Base Product Number: A2F200 Moisture Sensitivity Level (MSL): 3 (168 Hours)
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Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1381285-A2F200M3F-1FGG484 - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1381285-A2F200M3F-1FGG484
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1381285-A2F200M3F-1FGG484
Win Source Part Number: 1381285-A2F200M3F-1F GG484 Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 100MHz Package: Tray Standard Package: 1 pcs Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 41, FPGA - 94 RAM Size: 64KB Flash Size: 256KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Temperature Range - Operating: 0°C ~ 85°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 47 pct. REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Base Product Number: A2F200 Moisture Sensitivity Level (MSL): 3 (168 Hours)

Win Source Part Number: 1381285-A2F200M3F-1FGG484
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Series: SmartFusion®
Core Processor: ARM® Cortex®-M3
Speed: 100MHz
Package: Tray
Standard Package: 1 pcs
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 41, FPGA - 94
RAM Size: 64KB
Flash Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
Temperature Range - Operating: 0°C ~ 85°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 47 pct.
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: Microchip Technology
Base Product Number: A2F200
Moisture Sensitivity Level (MSL): 3 (168 Hours)

Buy Now Datasheet
System On Chip (SoC) - A2F200M3F-1FGG484 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
A2F200M3F-1FGG484
System On Chip (SoC) A2F200M3F-1FGG484
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 100MHz 484-FPBGA (23x23)

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 100MHz 484-FPBGA (23x23)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - A2F200M3F-1FGG484 - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
A2F200M3F-1FGG484
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) A2F200M3F-1FGG484
IC SOC CORTEX-M3 100MHZ 484FBGA

IC SOC CORTEX-M3 100MHZ 484FBGA

Supplier's Site
Shenzhen, China
Embedded - System On Chip (SoC)
A2F200M3F-1FGG484
Embedded - System On Chip (SoC) A2F200M3F-1FGG484
IC SOC CORTEX-M3 100MHZ 484FBGA

IC SOC CORTEX-M3 100MHZ 484FBGA

Supplier's Site Datasheet
System On Chip (SoC) - A2F200M3F-1FGG484 - ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
A2F200M3F-1FGG484
System On Chip (SoC) A2F200M3F-1FGG484
IC SOC CORTEX-M3 100MHZ 484FBGA

IC SOC CORTEX-M3 100MHZ 484FBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited ODG (Origin Data Global)
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1381285-A2F200M3F-1FGG484 A2F200M3F-1FGG484 A2F200M3F-1FGG484 A2F200M3F-1FGG484 A2F200M3F-1FGG484
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM ARM; ARM® Cortex®-M3 ARM ARM; ARM® Cortex®-M3 ARM® Cortex®-M3
Package / Case Tray 484-BGA
RAM Size 0.0640 MB 0.0640 MB 0.0640 MB 0.0640 MB
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