MG Chemicals Heat Transfer Compound; Silicone; whitepaste; 2 oz tub 860-60G

Description
Heat Transfer Compound, 400 V⁄MIL Dielectric Strength, 2.3 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D
  • Heat Transfer Compound; Silicone; whitepaste; 2 oz tub - 70125531 - Allied Electronics, Inc.
    Allied Electronics, Inc.
Description
Heat Transfer Compound, 400 V⁄MIL Dielectric Strength, 2.3 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D

Suppliers

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Product
Description
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Heat Transfer Compound; Silicone; whitepaste; 2 oz tub - 70125531 - Allied Electronics, Inc.
Allied Electronics, Inc.
Fort Worth, TX, USA
Heat Transfer Compound; Silicone; whitepaste; 2 oz tub
70125531
Heat Transfer Compound; Silicone; whitepaste; 2 oz tub 70125531
Heat Transfer Compound, 400 V⁄MIL Dielectric Strength, 2.3 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D

Heat Transfer Compound, 400 V⁄MIL Dielectric Strength, 2.3 Specific Gravity
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.

  • MIL-DTL-47113D
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category Industrial Greases
Product Number 70125531
Product Name Heat Transfer Compound; Silicone; whitepaste; 2 oz tub
Specific Gravity 2.3 specific gravity
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