MG Chemicals Heat Transfer Compound; Silicone; whitepaste; 1 pint tub 860-1P

Description
Heat Transfer Compound, 1 PSI @ 21 °C Vapor Pressure, 300 °C Boiling Point Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D
  • Heat Transfer Compound; Silicone; whitepaste; 1 pint tub - 70125532 - Allied Electronics, Inc.
    Allied Electronics, Inc.
Description
Heat Transfer Compound, 1 PSI @ 21 °C Vapor Pressure, 300 °C Boiling Point Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Compound; Silicone; whitepaste; 1 pint tub - 70125532 - Allied Electronics, Inc.
Allied Electronics, Inc.
Fort Worth, TX, USA
Heat Transfer Compound; Silicone; whitepaste; 1 pint tub
70125532
Heat Transfer Compound; Silicone; whitepaste; 1 pint tub 70125532
Heat Transfer Compound, 1 PSI @ 21 °C Vapor Pressure, 300 °C Boiling Point Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D

Heat Transfer Compound, 1 PSI @ 21 °C Vapor Pressure, 300 °C Boiling Point
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.

  • MIL-DTL-47113D
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category Industrial Greases
Product Number 70125532
Product Name Heat Transfer Compound; Silicone; whitepaste; 1 pint tub
Specific Gravity 2.4 specific gravity
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