MAYA Heat Transfer Technologies Limited NX Thermal

The Siemens PLM Software NX Thermal product is part of the NX Advanced Simulation environment. It solves engineering heat transfer problems within the most complex NX assemblies. NX Thermal combines the versatility of FE-based modeling with the accuracy of a finite volume solver. The high order finite volume NX Thermal simulations offer fast and high fidelity numerical predictions of radiation, conduction and convection heat transfer problems. NX Thermal can also be coupled seamlessly to NX Flow, the NX CFD solution, for strongly coupled thermo-fluid simulation. A unique run-time feature: Assembly context Thermal Couplings Thermal Couplings provide a powerful and efficient capability for modeling heat flow between unconnected parts and components. Multiple "what-if" scenarios and positioning of parts within an assembly can be investigated by defining thermal coupling parameters between unconnected parts once. Thermal coupling types include conductive, radiative, convective and interface couplings. Thermal couplings can be defined as varying within model parameters, such as temperature or heat load. All heat paths between unconnected parts are created at runtime automatically.