MAYA Heat Transfer Technologies Limited NX Electronic Systems Cooling

The Siemens PLM Software NX Electronic System Cooling product is an industry-specific vertical application that leverages the TMG-Flow and TMG-Thermal solvers as well as the PCB.xchange and other high tech and electronics industry-specific cooling capabilities in a bundle product. It provides a comprehensive set of tools to simulate 3D air flow and thermo-fluid behaviour in high tech and electronic systems. NX Electronic Systems Cooling helps resolve thermal engineering challenges early in the design process and is a valuable aid in understanding the physics of fluid flow and heat transfer for electronic enclosures and cooling applications. Some practical applications Determining electronic systems cooling strategies Enclosure, subsystem, and power supply thermal management Detailed thermal design of PC boards and multi-chip modules Thermally sensitive and critical components placement Heat sinks modeling Spacing requirements between critical parts Predicting fan operating conditions Volume and mass flow estimations Computing pressure inlet/outlet gradients and head losses Identifying recirculation areas and hot spot issues NX Electronic Systems Cooling has an interface with EDA design systems for direct and bi-directional PCB and FPC data exchanges. All of the leading PCB and FPC layout software packages are supported: Zuken Mentor Graphics Cadence VeriBest OrCAD Incases Comtel