Materion Corporation Plated Flanges

Description
Zentrix offers flanges plated with Ni:Co + Au for use in RF packages. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC). Like all of Zentrix's Ni: Co + Au electroplated finishes, these flanges are compatible with AuSi eutectic die attach. Plated flanges are used for wide variety of applications, including: Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams). Substrates for discrete ringframes that are epoxied onto the flange. The ringframes can be made of liquid crystal polymer (LCP), alumina, or some other dielectric. Substrates for circuit boards with cut-outs. The circuit can be formed on FR-4 , TeflonTM or some other PC board material. The chip is soldered directly onto the flange and is surrounded by the circuit board. Zentrix's proprietary plating process produces flange surfaces that are free of pits, scratches or other defects that would prevent a good die attach. Scratch-free surfaces are especially important for flanges with outer surfaces made of copper, which is a soft metal.
Description
Zentrix offers flanges plated with Ni:Co + Au for use in RF packages. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC). Like all of Zentrix's Ni: Co + Au electroplated finishes, these flanges are compatible with AuSi eutectic die attach. Plated flanges are used for wide variety of applications, including: Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams). Substrates for discrete ringframes that are epoxied onto the flange. The ringframes can be made of liquid crystal polymer (LCP), alumina, or some other dielectric. Substrates for circuit boards with cut-outs. The circuit can be formed on FR-4 , TeflonTM or some other PC board material. The chip is soldered directly onto the flange and is surrounded by the circuit board. Zentrix's proprietary plating process produces flange surfaces that are free of pits, scratches or other defects that would prevent a good die attach. Scratch-free surfaces are especially important for flanges with outer surfaces made of copper, which is a soft metal.

Suppliers

Company
Product
Description
Supplier Links
Mayfield Heights, OH, USA
Plated Flanges
Plated Flanges
Zentrix offers flanges plated with Ni:Co + Au for use in RF packages. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC). Like all of Zentrix's Ni: Co + Au electroplated finishes, these flanges are compatible with AuSi eutectic die attach. Plated flanges are used for wide variety of applications, including: Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams). Substrates for discrete ringframes that are epoxied onto the flange. The ringframes can be made of liquid crystal polymer (LCP), alumina, or some other dielectric. Substrates for circuit boards with cut-outs. The circuit can be formed on FR-4 , TeflonTM or some other PC board material. The chip is soldered directly onto the flange and is surrounded by the circuit board. Zentrix's proprietary plating process produces flange surfaces that are free of pits, scratches or other defects that would prevent a good die attach. Scratch-free surfaces are especially important for flanges with outer surfaces made of copper, which is a soft metal.

Zentrix offers flanges plated with Ni:Co + Au for use in RF packages. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC). Like all of Zentrix's Ni: Co + Au electroplated finishes, these flanges are compatible with AuSi eutectic die attach. Plated flanges are used for wide variety of applications, including:

  • Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams).
  • Substrates for discrete ringframes that are epoxied onto the flange. The ringframes can be made of liquid crystal polymer (LCP), alumina, or some other dielectric.
  • Substrates for circuit boards with cut-outs. The circuit can be formed on FR-4 , TeflonTM or some other PC board material. The chip is soldered directly onto the flange and is surrounded by the circuit board.

Zentrix's proprietary plating process produces flange surfaces that are free of pits, scratches or other defects that would prevent a good die attach. Scratch-free surfaces are especially important for flanges with outer surfaces made of copper, which is a soft metal.

Supplier's Site

Technical Specifications

  Materion Corporation
Product Category Metal Shapes and Stock
Product Name Plated Flanges
Type Aluminum; Nickel
Unlock Full Specs
to access all available technical data

Similar Products

 - Nickel 200 - Bar - High Performance Alloys, Inc.
High Performance Alloys, Inc.
Specs
Type Nickel; Pure, Unalloyed or Very Low Alloy Additions; Miscellaneous Nonferrous Metal or Alloy
Shape / Form Profile or Structural Shape; Round Bar or Rod Stock; Semi-finished, Mill Stock or Near Net Shapes; Bar Stock
Features Corrosion Resistant
View Details
Tungsten Heavy Alloy -  - MarsMetal
Specs
Type Refractory / Reactive; Tungsten
Processing, Temper & Finish Continuous, Centrifugal or Other Casting Process (optional feature)
Applications Aerospace or Aircraft Quality (optional feature); Automotive or Vehicular (optional feature); Armor / Ballistic Protection (optional feature); Nuclear (optional feature)
View Details
Resistance Alloy - Pure Nickel - Isabellenhutte USA
Specs
Type Nickel; Alloy
Features Heat Resistant
Processing, Temper & Finish Annealed; Enameled
View Details
Metal Bars & Metal Rods - 6614771 - RS Components, Ltd.
Specs
Shape / Form Bar Stock
Specifications 304s31
Width / OD 1.57 inch (40 mm)
View Details