Master Bond, Inc. Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation EP29LPTCHT

  • Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation - EP29LPTCHT - Master Bond, Inc. Master Bond, Inc.
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Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation - EP29LPTCHT - Master Bond, Inc.
Master Bond, Inc.
Hackensack, NJ, USA
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation EP29LPTCHT
Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Adhesives
Product Number EP29LPTCHT
Product Name Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
Use Temperature -60 to 350 F (-51 to 177 C)
CTE 12222222 to 13333333 µin/in-F (22000000 to 24000000 µm/m-C)
Chemical System Epoxy
Tensile (Break) 5000 to 6000 psi (34474 to 41369 KPa)
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