Macronix International Co., Ltd. Memory - Flash - MX30UF2G18AC-XKI MX30UF2G18AC-XKI

Description
Manufacturer: Macronix Win Source Part Number: 928595-MX30UF2G18AC- XKI Series: MX30UF Operating Temperature Range: -40°C ~ 85°C (TA) Features: FLASH - NAND (SLC) Memory IC 2Gb (256M x 8) Parallel 63-VFBGA (9x11) Package: 63-VFBGA Package: Tray Mounting: Surface Mount Family Name: MX30UF2 Categories: Integrated Circuits (ICs) Case / Package: 63-VFBGA (9x11) ECCN: 3A991B1A Popularity: High Fake Threat In the Open Market: 67 pct. Supply and Demand Status: Balance Quantity per package: 220 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 27 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0071
Request a Quote Datasheet
Description
Manufacturer: Macronix Win Source Part Number: 928595-MX30UF2G18AC- XKI Series: MX30UF Operating Temperature Range: -40°C ~ 85°C (TA) Features: FLASH - NAND (SLC) Memory IC 2Gb (256M x 8) Parallel 63-VFBGA (9x11) Package: 63-VFBGA Package: Tray Mounting: Surface Mount Family Name: MX30UF2 Categories: Integrated Circuits (ICs) Case / Package: 63-VFBGA (9x11) ECCN: 3A991B1A Popularity: High Fake Threat In the Open Market: 67 pct. Supply and Demand Status: Balance Quantity per package: 220 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 27 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0071
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - Flash - MX30UF2G18AC-XKI - 928595-MX30UF2G18AC-XKI - Win Source Electronics
Laguna Hills, CA, United States
Memory - Flash - MX30UF2G18AC-XKI
928595-MX30UF2G18AC-XKI
Memory - Flash - MX30UF2G18AC-XKI 928595-MX30UF2G18AC-XKI
Manufacturer: Macronix Win Source Part Number: 928595-MX30UF2G18AC- XKI Series: MX30UF Operating Temperature Range: -40°C ~ 85°C (TA) Features: FLASH - NAND (SLC) Memory IC 2Gb (256M x 8) Parallel 63-VFBGA (9x11) Package: 63-VFBGA Package: Tray Mounting: Surface Mount Family Name: MX30UF2 Categories: Integrated Circuits (ICs) Case / Package: 63-VFBGA (9x11) ECCN: 3A991B1A Popularity: High Fake Threat In the Open Market: 67 pct. Supply and Demand Status: Balance Quantity per package: 220 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 27 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0071

Manufacturer: Macronix
Win Source Part Number: 928595-MX30UF2G18AC-XKI
Series: MX30UF
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: FLASH - NAND (SLC) Memory IC 2Gb (256M x 8) Parallel 63-VFBGA (9x11)
Package: 63-VFBGA
Package: Tray
Mounting: Surface Mount
Family Name: MX30UF2
Categories: Integrated Circuits (ICs)
Case / Package: 63-VFBGA (9x11)
ECCN: 3A991B1A
Popularity: High
Fake Threat In the Open Market: 67 pct.
Supply and Demand Status: Balance
Quantity per package: 220
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 27 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0071

Buy Now Datasheet
Memory - MX30UF2G18AC-XKI - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FLASH - NAND (SLC) Memory IC 2Gbit Parallel 25 ns 63-VFBGA (9x11)

FLASH - NAND (SLC) Memory IC 2Gbit Parallel 25 ns 63-VFBGA (9x11)

Buy Now
IC FLASH 2GBIT PARALLEL 63VFBGA

IC FLASH 2GBIT PARALLEL 63VFBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - Memory - MX30UF2G18AC-XKI - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MX30UF2G18AC-XKI
Integrated Circuits (ICs) - Memory - Memory MX30UF2G18AC-XKI
IC FLASH 2GBIT PARALLEL 63VFBGA

IC FLASH 2GBIT PARALLEL 63VFBGA

Supplier's Site

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 928595-MX30UF2G18AC-XKI MX30UF2G18AC-XKI MX30UF2G18AC-XKI MX30UF2G18AC-XKI
Product Name Memory - Flash - MX30UF2G18AC-XKI Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category Flash Flash; FLASH Flash; Flash Flash; Non-Volatile
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Package Type BGA; 63-VFBGA (9x11) BGA; 63-VFBGA BGA
Access Time 25 ns 25 ns
Unlock Full Specs
to access all available technical data

Similar Products

Memory - AS5SP128K36 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SSRAM; SRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 1024 kbits
View Details
Memory - 27LV512-20/L089 - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category EPROM; EPROM
Access Time 200 ns
Density 512 kbits
View Details
SmartMedia Cards - 7723167 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
View Details