Single Diode Configuration: This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.
RF Diode PIN - Single 100V 250mA 1W Die
RF Diode PIN - Single 100V 250mA 1W Die
RF Diode PIN - Single 100V 250mA 1W Die
Discrete Semiconductor Products - Diodes - RF
| Richardson RFPD | DigiKey | Shenzhen Shengyu Electronics Technology Limited | ODG (Origin Data Global) | |
|---|---|---|---|---|
| Product Category | RF Diodes | RF Diodes | RF Diodes | PIN Diodes |
| Product Number | MADP-000402-12530P | 1465-MADP-000402-12530PCT-ND | MADP-000402-12530P | MADP-000402-12530P |
| Product Name | RF PIN Diode | RF Diodes | Discrete Semiconductor Products - Diodes - RF | RF Diodes |
| Configuration | Single | Single | ||
| Diode Type | PIN | PIN | ||
| Package | ODS-1253 | Die | Die | Die |
| VR | 70 volts | 100 volts |
