MACOM RF Diodes MADP-000402-12530P

Description
RF Diode PIN - Single 100V 250mA 1W Die
Request a Quote Datasheet
Description
RF Diode PIN - Single 100V 250mA 1W Die
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
RF Diodes - 1465-MADP-000402-12530PCT-ND - DigiKey
Thief River Falls, MN, United States
RF Diode PIN - Single 100V 250mA 1W Die

RF Diode PIN - Single 100V 250mA 1W Die

Buy Now Datasheet
RF Diodes - 1465-MADP-000402-12530PDKR-ND - DigiKey
Thief River Falls, MN, United States
RF Diode PIN - Single 100V 250mA 1W Die

RF Diode PIN - Single 100V 250mA 1W Die

Buy Now Datasheet
RF Diodes - 1465-MADP-000402-12530PTR-ND - DigiKey
Thief River Falls, MN, United States
RF Diode PIN - Single 100V 250mA 1W Die

RF Diode PIN - Single 100V 250mA 1W Die

Buy Now Datasheet
RF PIN Diode - MADP-000402-12530P - Richardson RFPD
Downers Grove, IL, United States
Single Diode Configuration: This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

Single Diode Configuration: This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

Supplier's Site Datasheet
Discrete Semiconductor Products - Diodes - RF - MADP-000402-12530P - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Discrete Semiconductor Products - Diodes - RF
MADP-000402-12530P
Discrete Semiconductor Products - Diodes - RF MADP-000402-12530P
Discrete Semiconductor Products - Diodes - RF

Discrete Semiconductor Products - Diodes - RF

Supplier's Site
DIODE,PIN,SURMOUNT

DIODE,PIN,SURMOUNT

Supplier's Site

Technical Specifications

  DigiKey Richardson RFPD Shenzhen Shengyu Electronics Technology Limited ODG (Origin Data Global)
Product Category RF Diodes RF Diodes RF Diodes PIN Diodes
Product Number 1465-MADP-000402-12530PCT-ND MADP-000402-12530P MADP-000402-12530P MADP-000402-12530P
Product Name RF Diodes RF PIN Diode Discrete Semiconductor Products - Diodes - RF RF Diodes
Configuration Single Single
Diode Type PIN PIN
Package Die ODS-1253 Die Die
VR 100 volts 70 volts
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