Parker Lord Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail 3002476

Description
Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.
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Description
Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.
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Suppliers

Company
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Description
Supplier Links
Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail - 6035A GALLON - Ellsworth Adhesives
Germantown, WI, USA
Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail
6035A GALLON
Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail 6035A GALLON
Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.

Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 6035A GALLON
Product Name Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail
Cure / Technology Two Component  
Chemical System Epoxy
Features Encapsulant, Potting Compound
Industry Semiconductors, IC's
Viscosity 9500 to 12000 cP
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