Parker Lord Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail 3002476

Description
Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.
Request a Quote Datasheet
Description
Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail - 6035A GALLON - Ellsworth Adhesives
Germantown, WI, USA
Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail
6035A GALLON
Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail 6035A GALLON
Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.

Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 6035A GALLON
Product Name Parker Lord CoolTherm® 6035 Epoxy Encapsulant Part A Black 1 gal Pail
Cure / Technology Two Component  
Chemical System Epoxy
Features Encapsulant, Potting Compound
Industry Semiconductors, IC's
Viscosity 9500 to 12000 cP
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Glass Metal & More -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
Specs
Substrate Compatibility Metal; Glass, metal, plastic, mosaic tiles, jewelry, mesh & more.
View Details
Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details