The Q2L SIDACtor® series provides bidirectional transient voltage protection in a low profile, chip scale package. The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment.Protection solution to meet: YD/T 950 YD/T 993 YD/T 1082 GR 1089 IEC 61000-4-5 ITU K.20/21 TIA-968-A RoHS compliant Chip Scale Package (CSP) sizing Wide range of IPP ratings including: 500 A for 2x10μs GR 1089 waveform 200 A for 5x310/10x700µs ITU/YDT waveform 100 A for 10x1000µs GR 1089 waveform 150 A for 10x560µs TIA-968 Bidirectional transient voltage protection Small footprint (QFN) Teccor® brand SIDACtor technology
The Q2L SIDACtor® series provides bidirectional transient voltage protection in a low profile, chip scale package. The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment.Protection solution to meet: YD/T 950 YD/T 993 YD/T 1082 GR 1089 IEC 61000-4-5 ITU K.20/21 TIA-968-A RoHS compliant Chip Scale Package (CSP) sizing Wide range of IPP ratings including: 500 A for 2x10μs GR 1089 waveform 200 A for 5x310/10x700µs ITU/YDT waveform 100 A for 10x1000µs GR 1089 waveform 150 A for 10x560µs TIA-968 Bidirectional transient voltage protection Small footprint (QFN) Teccor® brand SIDACtor technology
