Laird Technologies Thermal Pad; Thickness Laird CM20-NA-314

Description
THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m .K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm -cm; External Length:18mm; External Width:12mm; Product Range:
  • Thermal Pad; Thickness Laird - 04M8701 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m .K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm -cm; External Length:18mm; External Width:12mm; Product Range:
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad; Thickness Laird - 04M8701 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad; Thickness Laird
04M8701
Thermal Pad; Thickness Laird 04M8701
THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m .K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm -cm; External Length:18mm; External Width:12mm; Product Range:

THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m.K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm-cm; External Length:18mm; External Width:12mm; Product Range:

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 04M8701
Product Name Thermal Pad; Thickness Laird
Thermal Conductivity 3.85 W/m-K (2.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Two Part Thermally Conductive, Electrically Isolating Epoxy - EP35AOLV - Master Bond, Inc.
Master Bond, Inc.
Two Part Thermally Conductive, Electrically Isolating Epoxy
EP35AOLV
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Thermal Pads - 606920 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
606920
Specs
Use Temperature 356 F (180 C)
Thermal Conductivity 12.5 W/m-K (7.22 BTU-ft/hr-ft²-F)
View Details
Very Low Modulus, Highly Thermally Conductive and Non-Flammable interface material - SARCON ® PG25A - Fujipoly® America Corp.
Fujipoly® America Corp.
Very Low Modulus, Highly Thermally Conductive and Non-Flammable interface material
SARCON ® PG25A
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.1969 inch (1 to 5 mm)
View Details