Laird Technologies Thermal Pad; Thickness Laird CM20-NA-314

Description
THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m .K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm -cm; External Length:18mm; External Width:12mm; Product Range:
Datasheet
Description
THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m .K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm -cm; External Length:18mm; External Width:12mm; Product Range:
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad; Thickness Laird - 04M8701 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad; Thickness Laird
04M8701
Thermal Pad; Thickness Laird 04M8701
THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m .K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm -cm; External Length:18mm; External Width:12mm; Product Range:

THERMAL PAD; Thickness:0.2mm; Conductive Material:Acrylic Polymer; Thermal Conductivity:3.85W/m.K; Thermal Impedance:0.07°C/W; Volume Resistivity:0.002ohm-cm; External Length:18mm; External Width:12mm; Product Range:

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 04M8701
Product Name Thermal Pad; Thickness Laird
Thermal Conductivity 3.85 W/m-K (2.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® HiTech ® AD13-9692B -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Type Optical
Cure / Technology Single Component
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Ultra-high Thermal Conductivity Carbon Fiber Thermal Interface Material for Automotive Electronics - CSF40 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
No Mix, Thermally Conductive Epoxy Adhesive - EP3RR-80 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
View Details