Laird Technologies RFI and EMI - Contacts, Fingerstock and Gaskets BMI-C-007-01

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CONTACT BECU 3.3X1.0MM
  • RFI and EMI - Contacts, Fingerstock and Gaskets - BMI-C-007-01 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
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Description
CONTACT BECU 3.3X1.0MM
Datasheet

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RFI and EMI - Contacts, Fingerstock and Gaskets - BMI-C-007-01 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
BMI-C-007-01
RFI and EMI - Contacts, Fingerstock and Gaskets BMI-C-007-01
CONTACT BECU 3.3X1.0MM

CONTACT BECU 3.3X1.0MM

Buy Now Datasheet
Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
BMI-C-007-01
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets BMI-C-007-01
CONTACT BECU 3.3X1.0MM

CONTACT BECU 3.3X1.0MM

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Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number BMI-C-007-01 BMI-C-007-01
Product Name RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
Type Contact; Fingerstock
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