Laird Technologies Pads, Sheets, Bridges A15896-31

Description
Thermal Pad Gray 228.60mm x 228.60mm Square Tacky - Both Sides
Request a Quote Datasheet
Description
Thermal Pad Gray 228.60mm x 228.60mm Square Tacky - Both Sides
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A15896-31-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A15896-31-ND
Pads, Sheets, Bridges A15896-31-ND
Thermal Pad Gray 228.60mm x 228.60mm Square Tacky - Both Sides

Thermal Pad Gray 228.60mm x 228.60mm Square Tacky - Both Sides

Buy Now Datasheet
Thermal Gap Filler, 229 X 229Mm, 4Mm; Thermal Conductivity Laird - 52Y0864 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, 229 X 229Mm, 4Mm; Thermal Conductivity Laird
52Y0864
Thermal Gap Filler, 229 X 229Mm, 4Mm; Thermal Conductivity Laird 52Y0864
THERMAL GAP FILLER, 229 X 229MM, 4MM; Thermal Conductivity:5W/m.K; Conductive Material:Silicone; Thickness:4mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex SF600 RoHS Compliant: Yes

THERMAL GAP FILLER, 229 X 229MM, 4MM; Thermal Conductivity:5W/m.K; Conductive Material:Silicone; Thickness:4mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex SF600 RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number A15896-31-ND 52Y0864
Product Name Pads, Sheets, Bridges Thermal Gap Filler, 229 X 229Mm, 4Mm; Thermal Conductivity Laird
Thermal Conductivity 5 W/m-K (2.89 BTU-ft/hr-ft²-F) 5 W/m-K (2.89 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 672 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Industry Electronics; Semiconductors, IC's
View Details
Highly Thermally Conductive, Non-reactive Silicone-based Grease - SARCON ® SG26SL - Fujipoly® America Corp.
Specs
Form / Shape Grease, Paste
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
High reliability thermal pad for 5G mobile phone - SF1000 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 257 F (-50 to 125 C)
View Details