Laird Technologies Pads, Sheets, Bridges A15322-01

Description
Thermal Pad Green 228.60mm x 228.60mm Square
Request a Quote Datasheet
Description
Thermal Pad Green 228.60mm x 228.60mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A15322-01-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A15322-01-ND
Pads, Sheets, Bridges A15322-01-ND
Thermal Pad Green 228.60mm x 228.60mm Square

Thermal Pad Green 228.60mm x 228.60mm Square

Buy Now Datasheet
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird - 52Y0856 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird
52Y0856
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird 52Y0856
THERMAL GAP FILLER, 229 X 229MM, 0.5MM; Thermal Conductivity:1.2W/m. K; Conductive Material:Silicone Elastomer; Thickness:0.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product RoHS Compliant: Yes

THERMAL GAP FILLER, 229 X 229MM, 0.5MM; Thermal Conductivity:1.2W/m.K; Conductive Material:Silicone Elastomer; Thickness:0.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number A15322-01-ND 52Y0856
Product Name Pads, Sheets, Bridges Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird
Thermal Conductivity 1.2 W/m-K (0.6933 BTU-ft/hr-ft²-F) 1.2 W/m-K (0.6933 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability - MasterSil 157 - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
View Details
Customized thermal pads thermal conductivity silicone gap filler pad - SF600D - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details