Laird Technologies Thermal Interface, 12 X 18, 6Kv; Insulator Body Material Laird A15295-01

Description
THERMAL INTERFACE, 12" X 18", 6KV; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.13mm; Volume Resistivity:1000000M ohm-m; Thermal Impedance:1.36°C/W; Dielectric Strength:-; Product Range:-; RoHS Compliant: Yes
  • Thermal Interface, 12 X 18, 6Kv; Insulator Body Material Laird - 56Y0072 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL INTERFACE, 12" X 18", 6KV; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.13mm; Volume Resistivity:1000000M ohm-m; Thermal Impedance:1.36°C/W; Dielectric Strength:-; Product Range:-; RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface, 12 X 18, 6Kv; Insulator Body Material Laird - 56Y0072 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface, 12 X 18, 6Kv; Insulator Body Material Laird
56Y0072
Thermal Interface, 12 X 18, 6Kv; Insulator Body Material Laird 56Y0072
THERMAL INTERFACE, 12" X 18", 6KV; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.13mm; Volume Resistivity:1000000M ohm-m; Thermal Impedance:1.36°C/W; Dielectric Strength:-; Product Range:-; RoHS Compliant: Yes

THERMAL INTERFACE, 12" X 18", 6KV; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.13mm; Volume Resistivity:1000000Mohm-m; Thermal Impedance:1.36°C/W; Dielectric Strength:-; Product Range:-; RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 56Y0072
Product Name Thermal Interface, 12 X 18, 6Kv; Insulator Body Material Laird
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Heat Resistant, NASA Low Outgassing Epoxy Adhesive - Supreme 12AOHT-LO - Master Bond, Inc.
Master Bond, Inc.
Heat Resistant, NASA Low Outgassing Epoxy Adhesive
Supreme 12AOHT-LO
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Good elastic thermal conductive insulator for power supply - SC800-PI-2-K4 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Good elastic thermal conductive insulator for power supply
SC800-PI-2-K4
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details