Laird Technologies Pads, Sheets, Bridges A14420-01

Description
Thermal Pad Blue-Violet 228.60mm x 228.60mm Square Tacky - Both Sides
  • Pads, Sheets, Bridges - 926-1544-ND - DigiKey
    DigiKey
  • Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird - 58AJ9529 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
Thermal Pad Blue-Violet 228.60mm x 228.60mm Square Tacky - Both Sides
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - 926-1544-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
926-1544-ND
Pads, Sheets, Bridges 926-1544-ND
Thermal Pad Blue-Violet 228.60mm x 228.60mm Square Tacky - Both Sides

Thermal Pad Blue-Violet 228.60mm x 228.60mm Square Tacky - Both Sides

Buy Now Datasheet
Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird - 58AJ9529 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird
58AJ9529
Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird 58AJ9529
THERMAL GAP FILLER, SILICONE, 3W/M.K ROHS COMPLIANT: YES

THERMAL GAP FILLER, SILICONE, 3W/M.K ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number 926-1544-ND 58AJ9529
Product Name Pads, Sheets, Bridges Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal conductive gel pad for mobile phone smartphone - SF400 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal conductive gel pad for mobile phone smartphone
SF400
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details