Laird Technologies RFI and EMI - Contacts, Fingerstock and Gaskets 4787PA51H00944

Description
GK,NICU,PTAFG,PU,V0, DSH .200X.25
Description
GK,NICU,PTAFG,PU,V0, DSH .200X.25

Suppliers

Company
Product
Description
Supplier Links
RFI and EMI - Contacts, Fingerstock and Gaskets - 4787PA51H00944 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4787PA51H00944
RFI and EMI - Contacts, Fingerstock and Gaskets 4787PA51H00944
GK,NICU,PTAFG,PU,V0, DSH .200X.25

GK,NICU,PTAFG,PU,V0,DSH .200X.25

Buy Now

Technical Specifications

  Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials
Product Number 4787PA51H00944
Product Name RFI and EMI - Contacts, Fingerstock and Gaskets
Type Contact
Unlock Full Specs
to access all available technical data

Similar Products

RF Contacts - 1218121-1 - TE Connectivity
Specs
Type Contact
Applications Motor or Generator
View Details
Battery Electrode Materials - PolyGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
OD / Width 12 to 48 inch (305 to 1219 mm)
Thickness 0.0020 to 0.0400 inch (0.0508 to 1.02 mm)
View Details
MicroForm - .125” - Wallner Expac
Specs
Type Anode / Anode Material; Cathode / Cathode Material
Shape / Form Diamond
Plating / Coating Nickel (optional feature)
View Details