Laird Technologies RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4358PA51H01800

Description
GSKT FAB/FOAM 2.5X457.2MM DSHAPE
  • RFI and EMI - Contacts, Fingerstock and Gaskets - 4358PA51H01800 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
GSKT FAB/FOAM 2.5X457.2MM DSHAPE
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4358PA51H01800
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4358PA51H01800
GSKT FAB/FOAM 2.5X457.2MM DSHAPE

GSKT FAB/FOAM 2.5X457.2MM DSHAPE

Supplier's Site
RFI and EMI - Contacts, Fingerstock and Gaskets - 4358PA51H01800 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4358PA51H01800
RFI and EMI - Contacts, Fingerstock and Gaskets 4358PA51H01800
GSKT FAB/FOAM 2.5X457.2MM DSHAPE

GSKT FAB/FOAM 2.5X457.2MM DSHAPE

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4358PA51H01800 4358PA51H01800
Product Name RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets RFI and EMI - Contacts, Fingerstock and Gaskets
Shape / Form Fabric Over Foam
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