Laird Technologies RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4224AB51H04198

Description
GK NICU PTAFG PU V0 REC
Datasheet
Description
GK NICU PTAFG PU V0 REC
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4224AB51H04198
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4224AB51H04198
GK NICU PTAFG PU V0 REC

GK NICU PTAFG PU V0 REC

Supplier's Site
RFI and EMI - Contacts, Fingerstock and Gaskets - 4224AB51H04198 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4224AB51H04198
RFI and EMI - Contacts, Fingerstock and Gaskets 4224AB51H04198
GK NICU PTAFG PU V0 REC

GK NICU PTAFG PU V0 REC

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4224AB51H04198 4224AB51H04198
Product Name RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets RFI and EMI - Contacts, Fingerstock and Gaskets
Shape / Form Fabric Over Foam
Unlock Full Specs
to access all available technical data

Similar Products

Battery Electrode Materials - PolyGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
OD / Width 12 to 48 inch (305 to 1219 mm)
Thickness 0.0020 to 0.0400 inch (0.0508 to 1.02 mm)
View Details
RFI and EMI - Contacts, Fingerstock and Gaskets - 114-0032-S - Quarktwin Technology Ltd.
Specs
Type Contact; Gasket
Material Cu
Length 9.84 inch (250 mm)
View Details
Crimp Contacts - 1801238 - RS Components, Ltd.
Specs
Shape / Form Pin
Contact Material Cu; Beryllium copper
Plating / Coating Gold; Gold
View Details
2 suppliers