Laird Technologies RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4209PA22101800

Description
GASKT FAB/FOAM 3.94X457.2MM RECT
Datasheet
Description
GASKT FAB/FOAM 3.94X457.2MM RECT
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4209PA22101800
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4209PA22101800
GASKT FAB/FOAM 3.94X457.2MM RECT

GASKT FAB/FOAM 3.94X457.2MM RECT

Supplier's Site
RFI and EMI - Contacts, Fingerstock and Gaskets - 4209PA22101800 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4209PA22101800
RFI and EMI - Contacts, Fingerstock and Gaskets 4209PA22101800
GASKT FAB/FOAM 3.94X457.2MM RECT

GASKT FAB/FOAM 3.94X457.2MM RECT

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4209PA22101800 4209PA22101800
Product Name RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets RFI and EMI - Contacts, Fingerstock and Gaskets
Shape / Form Fabric Over Foam
Unlock Full Specs
to access all available technical data

Similar Products

Battery Electrode Materials - PolyGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
OD / Width 12 to 48 inch (305 to 1219 mm)
Thickness 0.0020 to 0.0400 inch (0.0508 to 1.02 mm)
View Details
Contact, Receptacle, 20-16Awg, Crimp; Product Range Amp Te Connectivity - 90B6478 - Newark, An Avnet Company
Specs
Type Contact
Material Cu
Shape / Form Socket or Receptacle; Socket
View Details
Specs
Type Contact
Material Magnesium (optional feature); Silver (optional feature); Cu (optional feature); Palladium (optional feature)
Shape / Form Custom / Application Specific
View Details