Laird Technologies RFI and EMI - Contacts, Fingerstock and Gaskets 4139AD51K01445

Description
GASKT FAB/FOAM 3.81X367MM DSHAPE
  • RFI and EMI - Contacts, Fingerstock and Gaskets - 4139AD51K01445 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Description
GASKT FAB/FOAM 3.81X367MM DSHAPE

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RFI and EMI - Contacts, Fingerstock and Gaskets - 4139AD51K01445 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4139AD51K01445
RFI and EMI - Contacts, Fingerstock and Gaskets 4139AD51K01445
GASKT FAB/FOAM 3.81X367MM DSHAPE

GASKT FAB/FOAM 3.81X367MM DSHAPE

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Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4139AD51K01445
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4139AD51K01445
GASKT FAB/FOAM 3.81X367MM DSHAPE

GASKT FAB/FOAM 3.81X367MM DSHAPE

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Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4139AD51K01445 4139AD51K01445
Product Name RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
Type Contact
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