Laird Technologies RFI and EMI - Contacts, Fingerstock and Gaskets 4078PA51G01200

Description
GSKT FAB/FOAM 9.1X304.8MM DSHAPE
Datasheet
Description
GSKT FAB/FOAM 9.1X304.8MM DSHAPE
Datasheet

Suppliers

Company
Product
Description
Supplier Links
RFI and EMI - Contacts, Fingerstock and Gaskets - 4078PA51G01200 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4078PA51G01200
RFI and EMI - Contacts, Fingerstock and Gaskets 4078PA51G01200
GSKT FAB/FOAM 9.1X304.8MM DSHAPE

GSKT FAB/FOAM 9.1X304.8MM DSHAPE

Buy Now Datasheet
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4078PA51G01200
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4078PA51G01200
GSKT FAB/FOAM 9.1X304.8MM DSHAPE

GSKT FAB/FOAM 9.1X304.8MM DSHAPE

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4078PA51G01200 4078PA51G01200
Product Name RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
Type Contact; Fabric Over Foam
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