Features
SMD (Hybrid IC)
Plural semiconductors in one package offers downsized system with high performance and standardization
Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance
High precision modules by function trimming
Less mounting problem because of the decreasing number of the terminals
KOA Speer Electronics, Inc.
Done
Request a Quote
Email Supplier
Datasheet
Description
Features
SMD (Hybrid IC)
Plural semiconductors in one package offers downsized system with high performance and standardization
Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance
High precision modules by function trimming
Less mounting problem because of the decreasing number of the terminals
Features
SMD (Hybrid IC)
Plural semiconductors in one package offers downsized system with high performance and standardization
Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance
High precision modules by function trimming
Less mounting problem because of the decreasing number of the terminals
Features
SMD (Hybrid IC)
Plural semiconductors in one package offers downsized system with high performance and standardization
Wiring space saving by multilayer fine patterns on build-up substrate. No signal delay by shortened wiring distance
High precision modules by function trimming
Less mounting problem because of the decreasing number of the terminals
