Features
KOAs substrates are suitable for bare chip mounting, as the thermal expansion cofficient is close to silicons one and outstanding dimensional accuracy and flatness.
Thanks to our low dielectric ceramics and low resistive conductors, the substrates excel in the high frequency characteristics
Minituarization and high integration are possible because of multilayer wiring, multi-cavity structure and the surface/buried printing resistors possibilities
Special shapes of substrate and cavity such as circle shape, polygonal shape and concave or convex shape are available
Thermal vias under bare chips can be implemented to improve the thermal conductivity of the substrate
The substrates are outstanding in heat resistance and humidity resistance. There will be no outgas occurrence from the ceramics.
Products meet EU RoHS requirements
Features
KOAs substrates are suitable for bare chip mounting, as the thermal expansion cofficient is close to silicons one and outstanding dimensional accuracy and flatness.
Thanks to our low dielectric ceramics and low resistive conductors, the substrates excel in the high frequency characteristics
Minituarization and high integration are possible because of multilayer wiring, multi-cavity structure and the surface/buried printing resistors possibilities
Special shapes of substrate and cavity such as circle shape, polygonal shape and concave or convex shape are available
Thermal vias under bare chips can be implemented to improve the thermal conductivity of the substrate
The substrates are outstanding in heat resistance and humidity resistance. There will be no outgas occurrence from the ceramics.
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KOA Speer Electronics, Inc.
