Features
Adjustment processes are decreased by function and ratio trimmings
High density mounting by bonding (COB)
Various types of package are available
High reliability achieved by KOAs original thick film technology
Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production
Features
Adjustment processes are decreased by function and ratio trimmings
High density mounting by bonding (COB)
Various types of package are available
High reliability achieved by KOAs original thick film technology
Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production
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KOA Speer Electronics, Inc.
