KOA Speer Electronics, Inc. KA Hybrid IC SUbstrates

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KA Hybrid IC SUbstrates -  - KOA Speer Electronics, Inc.
Bradford, PA, United States
KA Hybrid IC SUbstrates
Features Adjustment processes are decreased by function and ratio trimmings High density mounting by bonding (COB) Various types of package are available High reliability achieved by KOAs original thick film technology Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production

Features

  • Adjustment processes are decreased by function and ratio trimmings
  • High density mounting by bonding (COB)
  • Various types of package are available
  • High reliability achieved by KOAs original thick film technology
  • Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production
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Technical Specifications

  KOA Speer Electronics, Inc.
Product Category Electroceramics
Product Name KA Hybrid IC SUbstrates
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