IC FLASH 256GBIT EMMC 153FBGA Product overview: THGBMUG8C2LBAIL from Kioxia America, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-THGBMUG8C2LBAIL can be used for catalog matching and distributor lookup.
Alternative Parts (Cross-Reference): Cross
Manufacturer: Kioxia America, Inc.
Category: Integrated Circuits (ICs) Memory Memory
Package: Tray
Product Status: Active
Memory Size: 32 GB
Mounting Style: SMD/SMT
IC FLASH 256GBIT EMMC 153FBGA
| DigiKey | ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Quarktwin Technology Ltd. | ODG (Origin Data Global) | Lingto Electronic Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 1853-THGBMUG8C2LBAIL-ND | 774-THGBMUG8C2LBAIL | THGBMUG8C2LBAIL | THGBMUG8C2LBAIL | THGBMUG8C2LBAIL | |
| Product Name | Memory | Memory IC and Storage Component | Integrated Circuits (ICs) Memory Memory | Memory | Memory | Memory |
| Memory Category | Flash | Flash; Non-Volatile | Flash | Flash; FLASH - NAND | ||
| Operating Temperature | -20 to 85 C (-4 to 185 F) | -20 to 85 C (-4 to 185 F) | -20 to 85 C (-4 to 185 F) | |||
| Package Type | 153-WBGA | BGA; Tray | 153-WBGA |
