Keystone Electronics Corp. Transistor Insulator; Insulator Body Material Keystone 4669

Description
TRANSISTOR INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.076mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Length:0.87" RoHS Compliant: Yes
Datasheet
Description
TRANSISTOR INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.076mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Length:0.87" RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Transistor Insulator; Insulator Body Material Keystone - 30C5802 - Newark, An Avnet Company
Chicago, IL, United States
Transistor Insulator; Insulator Body Material Keystone
30C5802
Transistor Insulator; Insulator Body Material Keystone 30C5802
TRANSISTOR INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.076mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Length:0.87" RoHS Compliant: Yes

TRANSISTOR INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.076mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Length:0.87" RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 30C5802
Product Name Transistor Insulator; Insulator Body Material Keystone
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Phase change thermal pad for power module and memory modules - SP205A-35 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -40 to 257 F (-40 to 125 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details