JST Manufacturing, Inc. Single Wafer Etching System

Description
JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated dispense from chemical storage reservoir provides repeatable volume and mixing control. Backside rinsing or isolation is also available. The module can be installed in an existing workstation or let JST design one for you. Standard Features Adjustable Oscillating Spray Nozzles & Pressures Manual Wafer Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm.Multi Substrate Size Capability
Description
JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated dispense from chemical storage reservoir provides repeatable volume and mixing control. Backside rinsing or isolation is also available. The module can be installed in an existing workstation or let JST design one for you. Standard Features Adjustable Oscillating Spray Nozzles & Pressures Manual Wafer Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm.Multi Substrate Size Capability

Suppliers

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Product
Description
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Single Wafer Etching System -  - JST Manufacturing, Inc.
Boise, ID, USA
Single Wafer Etching System
Single Wafer Etching System
JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated dispense from chemical storage reservoir provides repeatable volume and mixing control. Backside rinsing or isolation is also available. The module can be installed in an existing workstation or let JST design one for you. Standard Features Adjustable Oscillating Spray Nozzles & Pressures Manual Wafer Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm.Multi Substrate Size Capability

JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated dispense from chemical storage reservoir provides repeatable volume and mixing control. Backside rinsing or isolation is also available. The module can be installed in an existing workstation or let JST design one for you. Standard Features Adjustable Oscillating Spray Nozzles & Pressures Manual Wafer Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm.Multi Substrate Size Capability

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Technical Specifications

  JST Manufacturing, Inc.
Product Category Etchers and Etching Machines
Product Name Single Wafer Etching System
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