The SG-BGA-6177 GHz BGA socket from Ironwood Electronics, Inc. is designed for high-frequency applications, providing a bandwidth of 6.5 to 10 GHz. This socket utilizes a zero insertion force (ZIF) mechanism, allowing for easy chip placement without soldering, which is beneficial for prototyping and testing. The socket is compatible with various BGA package sizes and pitches, specifically accommodating 1.27mm, 1.0mm, 0.8mm, and 0.75mm pitches. The socket features a low-resistance conductive elastomer, which ensures reliable electrical connections with a contact resistance of approximately 23mΩ. It supports a maximum current carrying capacity of 50mA per wire and is designed for a wide operating temperature range of -35°C to +85°C, with short-term exposure up to 100°C. The elastomer requires cleaning after 200 cycles and has a shelf life of one year. Engineers should consider the SG-BGA-6177 socket for applications requiring high-speed performance and ease of use in testing environments, while ensuring compatibility with their specific IC package dimensions and specifications.
Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely eliminate soldering. The zero insertion force (ZIF) chip placement system can also provide heat sink capability.
| Ironwood Electronics, Inc. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Number | SG-BGA-6177 |
| Product Name | GHz BGA Socket |
| Product Type | IC Socket |
| Socket Type | BGA |
| Mounting | ZIF, Direct Mount, Solderless |
| Features | Solderless; ZIF Lock; Screw Lock |
| Military Standards | MIL-STD202 |
